In many SMT surface mount processing and PCBA operations, for some reason, after using SMT surface mount red glue technology to paste parts and cured electronic components, if defects are found and need to be replaced, the cured surface mount red glue needs to be removed. So how to remove the cured surface mount red glue of the already pasted components? The commonly used method is to evenly heat the components that need to be repaired (cured red glue) with a hot air gun. If the components have been soldered, the temperature should be increased to melt the solder joints, and the components should be removed in a timely manner with tweezers. Large ICs need to be heated at the repair station. After removing the components, the residual glue should still be slowly removed with a small knife with the help of the hot air gun. Do not damage the PCB solder pads. If necessary, re glue and use a hot air gun to locally cure (ensuring heating temperature and time). If the components can withstand high temperatures, directly aim a hot air gun at the red glue points at around 300 ℃ and blow for about 10 seconds, then take a pinch of tweezers

Note: SMT patch red glue is a non repairable product, and the red glue will become brittle under high temperature conditions. Therefore, the only way to keep it at high temperature and let it become brittle and fall off is to!