PCB electroplating gold is obtained through electrolysis, while gold plating gold is obtained through chemical reduction reactions!

Simply put, PCB electroplating, like other PCB electroplating, requires power and rectifiers. There are many types of processes, including cyanide containing, non cyanide systems, and non cyanide systems such as citric acid and sulfite. The systems used in the PCB industry are all non cyanide systems.

Gold plating (chemical gold plating) does not require electricity and deposits gold onto the surface of the plate through chemical reactions in a solution.

They each have their own advantages and disadvantages. In addition to being powered on or off, PCB boards can be made with thick metal, as long as the time is extended, making them suitable for bonding boards. The chance of discarding PCB electroplating solution is smaller than that of electroplating solution. But PCB manufacturing requires full board conductivity and is not suitable for making particularly thin circuits.

Gold is generally very thin (less than 0.2 microns) and has low purity. The working fluid can only be discarded to a certain extent.

One is PCB electroplating to form nickel gold

One method is to use the self oxidation-reduction reaction of sodium hypophosphite to form a nickel layer, and to use displacement reaction to form a gold layer, which is a chemical method.

Ivy: In addition to differences in manufacturing processes, PCB electroplating gold and immersion gold also have the following differences:

PCB electroplating has a thick gold layer and high hardness, so it is usually used for frequently plugging and unplugging sliding parts, such as the gold fingers of switch cards;

Sinking gold is beneficial for mounting and also used for lead-free soldering due to the flat surface of the solder pad.