Circuit boards made with copper substrates offer superior thermal conductivity, electrical insulation, and machinability. Copper plates serve as the primary substrate material, providing enhanced thermal performance and significantly better heat dissipation compared to aluminum or iron.

1. The thermal insulation layer is one of the core components of copper substrates, with copper foil thicknesses typically ranging from 35μm to 280μm to achieve strong current-carrying capacity. Compared to aluminum substrates, which primarily consist of aluminum with higher thermal resistance, copper substrates offer superior heat dissipation during operation. Their use is recommended to ensure product stability through enhanced thermal management.

2. Copper substrates are commonly used as heat-dissipating substrates in circuit components. In products with high power density circuits and numerous circuit elements, where some substrates fail to meet requirements for aging resistance or tolerance to mechanical and thermal stress, copper substrates excel due to their superior heat dissipation properties. If a copper substrate remains free of blistering or delamination at 280°C, it demonstrates strong voltage resistance. It contains no heavy metals and causes no environmental pollution. The product employs SMT surface mount technology. Its circuit design effectively manages thermal diffusion, eliminating the need for additional heat sinks. This significantly reduces the product's volume and greatly enhances its machinability.