Shenzhen 506 Technology Co., Ltd.

Process Capability

Technical Item	Technical Specification
Board Material Type	Aluminum Substrate / Copper Substrate / Copper-Aluminum Composite Board / FR4
Product Category	Single/Double-Sided Substrate / Single/Double-Sided FR4 / Thermally & Electrically Isolated Copper Substrate
Surface Finish	HASL / OSP / ENIG / Immersion Silver / Electroplated Nickel Gold
Maximum Dimensions	1450mm × 600mm
Minimum Dimensions	40mm × 40mm
Minimum Line Width/Spacing	0.1mm
Board Warpage	≤0.07% (for 1.6mm thickness, 450mm × 300mm dimensions)
Processing Thickness	0.15mm - 6.0mm
Copper Foil Thickness	25μm - 140μm
Forming Dimension Tolerance	±0.1mm
V-CUT Alignment Accuracy	±0.1mm
Production Capacity	20,000 square meters/month
Hole Position Deviation	±0.076mm
Forming Dimension Tolerance Range	Routing and Die-Cutting: ±0.1mm